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05181
SLVU2.8-8
ULTRA LOW CAPACITANCE TVS ARRAY
APPLICATIONS
Ethernet - 10/100/1000 Base T Cellular Phones Audio/Video Inputs Handheld Electronics Personal Digital Assistant (PDA)
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns 61000-4-5 (Surge): 24A, 8/20s - Level 2(Line-Ground) & Level 3(Line-Line)
SO-8
FEATURES
600 Watts Peak Pulse Power per Line (tp = 8/20s) Provides Protection For Four Line Pairs ESD Protection > 40 kilovolts Low Leakage Current < 1.0A Ultra Low Capacitance: 6pF Typical RoHS Compliant
MECHANICAL CHARACTERISTICS
Molded JEDEC SO-8 Weight 70 milligrams (Approximate) Available in Lead-Free Pure-Tin Plating(Annealed) Solder Reflow Temperature: Pure-Tin - Sn, 100: 260-270C Consult Factory for Leaded Device Availability Flammability Rating UL 94V-0 12mm Tape and Reel Per EIA Standard 481 Marking: Marking Code, Logo, Date Code & Pin One Defined By Dot on Top of Package
PIN CONFIGURATION
8
7
6
5
1
2
3
4
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SLVU2.8-8
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (tp = 8/20s) - See Fig. 1 Peak Pulse Current (tp = 8/20s) Lead Soldering Temperature Operating Temperature Storage Temperature
SYMBOL
PPP IPP IFRM TL TSTG
VALUE
600 30 260 -55 to 150 -55 to 150
UNITS
Watts Amps C C C
ELECTRICAL CHARACTERISTICS PER LINE
PART NUMBER DEVICE MARKING RATED STAND-OFF VOLTAGE (See Note 1) MINIMUM BREAKDOWN VOLTAGE (See Note 1) MINIMUM SNAPBACK VOLTAGE (See Note 1)
@ 25C Unless Otherwise Specified
MAXIMUM CLAMPING VOLTAGE (See Note 1) (See Fig. 2) MAXIMUM LEAKAGE CURRENT (See Note 1) TYPICAL CAPACITANCE (See Note 1)
VWM VOLTS SLVU2.8-8 SL8 2.8
@ 1mA V(BR) VOLTS 3.0
@ISB = 50mA VSB VOLTS 2.8
@IPP = 2A VC VOLTS 5.5
@IPP = 5A VC VOLTS 8.5
@IPP = 24A @IPP = 30A VC VC VOLTS VOLTS 15 17
@VWM ID A 1.0
@0V, 1MHz C pF 6
Note 1: Device measured between pin 1 to 2, pin 3 to 4, pin 5 to 6 and pin 7 to 8.
10,000
PPP - Peak Pulse Power - Watts
FIGURE 1 PEAK PULSE POWER VS PULSE TIME
IPP - Peak Pulse Current - % of IPP
120 100 80 60 40 20 0 tf
FIGURE 2 PULSE WAVE FORM
Peak Value IPP TEST WAVEFORM PARAMETERS tf = 8s td = 20s
1,000
500W 8/20s Waveform
e-t
100
td = t I /2 PP
10 0.1
1
10 100 td - Pulse Duration - s
1,000
10,000
0
5
10
15 t - Time - s
20
25
30
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SLVU2.8-8
GRAPHS
FIGURE 3 POWER DERATING CURVE
100 80
% Of Rated Power
Peak Pulse Power 8/20s
60
40 20 Average Power 0 0 25 50 75 100 125 TL - Lead Temperature - C 150
FIGURE 4 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT 20
VC - Clamping Voltage - V
16 12 8 4 0
0
5
10 15 20 25 IPP - Peak Pulse Current A
30
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SLVU2.8-8
APPLICATION NOTE
Electronic equipment is susceptible to damage caused by Electrostatic Discharge (ESD), Electrical Fast Transients (EFT), and tertiary lightning effects. Knowing that equipment can be damaged, the SLVU2.8-8 was designed to provide the level of protection required to safe guard sensitive equipment. This product can be used in different configurations to provide a level of protection to meet bidirectional requirements either in a common-mode or differential-mode configuration. BIDIRECTIONAL COMMON-MODE CONFIGURATION (Figure 1)
Figure 1. Bidirectional Common-Mode Protection
The SLVU2.8-8 provides up to four lines of protection in a common-mode configuration as depicted in figure 1. Circuit connectivity is as follows: Line 1 is connected to Pin 1 Line 2 is connected to Pin 8 Line 3 is connected to Pin 5 Line 4 is connected to Pin 4 Pins 2, 3, 6 and 7 are connected to ground BIDIRECTIONAL DIFFERENTIAL-MODE CONFIGURATION (Figure 2) The SLVU2.8-8 provides up to four line paris of protection in a differential-mode configuration as depicted in figure 2. Circuit connectivity is as follows: Line Pair 1 is connected to Pins 1 & 2 Line Pair 2 is connected to Pins 3 & 4 Line Pair 3 is connected to Pins 7 & 8 Line Pair 4 is connected to Pins 5 & 6
Figure 2. Bidirectional Differential-Mode Protection
CIRCUIT BOARD LAYOUT RECOMMENDATIONS Circuit board layout is critical for Electromagnetic Compatibility (EMC) protection. The following guidelines are recommended: The protection device should be placed near the input terminals or connectors, the device will divert the transient current immediately before it can be coupled into the nearby traces. The path length between the TVS device and the protected line should be minimized. All conductive loops including power and ground loops should be minimized. The transient current return path to ground should be kept as short as possible to reduce parasitic inductance. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias.

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SLVU2.8-8
SO-8 PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
-A-
SO-8
8
5 -B - P
+ 0.010 (0.25 MM) M B M 4 PL
DIM A B C D F G J K P R
NOTES 1. 2. 3. 4. 5. 6.
PACKAGE DIMENSIONS MILLIMETERS MIN MAX 4.80 3.80 1.35 0.35 0.40 1.27 BSC 0.18 0.10 5.80 0.25 INCHES MIN MAX
1
4
G
D C R x 45 0 - 10
K 0.010 (0.25 MM) M T B S A S 8 PL
-T-
+
J
F
0.196 5.00 0.189 0.150 0.157 4.00 1.75 0.054 0.068 0.49 0.014 0.019 0.049 1.250 0.016 1.27 BSC 0.05 BSC 0.05 BSC 0.25 0.007 0.009 0.004 0.008 0.25 6.20 0.229 0.244 0.019 0.50 0.010
MOUNTING PAD
0.050 0.005 0.030 0.005
- T - = Seating Plane and Datum Surface. Dimensions "A" and "B" are Datum. Dimensions "A" and "B" do not include mold protrusion. Maximum mold protrusion is 0.015" (0.380 mm) per side. Dimensioning and tolerances per ANSI Y14.5M, 1982. Dimensions are exclusive of mold flash and metal burrs.
TAPE & REEL/BULK ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA-481. 2. Suffix-T7 = 7 Inch Reel - 1,000 pieces per 12mm tape, i.e. SLVU2.8-8-T7. 3. Suffix-T13 = 13 Inch Reel - 2,500 pieces per 12mm tape, i.e., SLVU2.8-8-T13. 4. Suffix - LF = Lead-Free, Pure-Tin Plating, i.e., SLVU2.8-8-LF-T7. 5. No Suffix = Product Shipped in Tubes of 98 pcs per Tube.
0.160 0.005
0.245 MIN
0.045 0.005
Outline & Dimensions: Rev 1 - 11/01, 06009
COPYRIGHT (c) ProTek Devices 2007 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com
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